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Product

Copper(II) tetrafluoroborate

CAS No:38465-60-0     
Usages:Used for plating solution of copper and its alloy.
Introduction:

 

 

Chemical Name

Copper(II) tetrafluoroborate

Molecular formula

Cu(BF4)2

CAS No.

38465-60-0

EINECS No.

253-959-4

Molecular weight

237.16

Molecular Structure

Details

 Copper fluoroborate (plating grade)

Appearance: dark blue liquid, relative density is about 1.53

Copper fluoroborate (base on Cu2+), % ≥12.0

Free fluoroboric acid (HBF4), % ≤2.0

Free boric acid (HBO3), % ≤1.0

Cl-, % ≤0.005

Iron (Fe), % ≤0.01

Sulfate (SO42-), % ≤0.005

Package:  30kg or 250kg plastic drum

 

Main Application

Used for plating solution of copper and its alloy.

2-Mercaptothiazoline

CAS No:96-53-7     
Usages:Used as intermediates, copper plating additives.
Introduction:

 

 

Chemical Name

2-Mercaptothiazoline

Molecular formula

C3H5NS2

CAS No.

96-53-7

EINECS No.

202-512-1

Molecular weight

119.21

Molecular Structure

Details

Appearance: White or white crystalline powder

Assay: 99%min.

Melting point: 103~106℃

Loss on drying: 0.5% max

Packing: 25kgfibre drum

Main Application

Used as intermediates, copper plating additives.

Bis-(sodium sulfopropyl)-disulfide (SPS)

CAS No:27206-35-5     
Usages:It is used as brightening agent & functional grain refinement agent for copper plating and combined
Introduction:

 

 

Chemical Name

Bis-(sodium sulfopropyl)-disulfide (SPS)

Molecular formula

C6H12O6S4Na2

CAS No.

27206-35-5

EINECS No.

248-324-3

Molecular weight

354.4

Molecular Structure

Details

Appearance: White  powder

Assay: 95% min.

Melting point: 197~198℃

Addition level : 0.01~0.02g/l

Consumption (g/KAH): 0.5~0.8

Main Application

It is used as brightening agent & functional grain refinement agent for

 copper plating and combined with DAE、EDEP and so on.

 

3-S-isothiuronium propyl sulfonate(UPS)

CAS No:21668-81-5     
Usages:UPS is used for the deposition of bright, ductile copper coatings in combination with polyethylene g
Introduction:

 

Chemical Name

3-S-isothiuronium propyl sulfonate (UPS) 

Molecular formula

C4H10N2O3S2

CAS No.

21668-81-5

EINECS No.

242-644-7

Molecular weight

265.35

Molecular Structure

Details

Appearance: White crystal

Assay: 95.0% min.

Secondary constituents: 3-Hydroxypropane-1-Sulfonic acid;    

Water Solubility(20℃):Water:4%  

Methanol:<0.5%                            

Ethanol:<0.5%

Addition level : 10~100mg/l

Packing: 25kg or 5kg / fiber drum or as required

Main Application

 

UPS is used for the deposition of bright, ductile copper coatings in

 combination with polyethylene glycols and non-ionic surfactants.

 The employment of UPS is also possible in other acid electroplating 

baths for silver and palladium deposition.

Thioflavine T

CAS No:2390-54-7     
Usages:Used as dye in Acid Copper plating.
Introduction:

 

 

Chemical Name

Thioflavine T

Another name

C.I. 49005; Basic Yellow 1; 

2-[4-(Dimethylamino)phenyl]-3,6-dimethylbenzothiazolium chloride

CAS  No.

2390-54-7

Molecular formula

C17H19ClN2S

EINECS No.

219-228-9

Molecular weight

318.86

Molecular Structure

Details

Appearance: yellow powder

Assay: 98.0% min.

Package: 25kg/fibre drum

Main Application

Used as dye in Acid Copper plating. 

DPS

CAS No:18880-36-9     
Usages:DPS is used as brightening agent in acid copper electroplating baths and has, in combination with po
Introduction:

 

Chemical Name

N,N-Dimethyl-dithiocarbamyl propyl sulfonic acid, sodium salt (DPS)

Molecular formula

C6H12NNAO3S3

CAS No.

18880-36-9

EINECS No.

242-644-7

Molecular weight

265.35

Molecular Structure

Details

Appearance: White glossy plate crystal

Assay: 98.0% min.

Addition level : 10~100mg/l

Packing: 25kg or 5kg / fiber drum or as required

Main Application

DPS is used as brightening agent in acid copper electroplating baths and has,

 in combination with polyethers and wetting agents, the effect of depositing a 

bright and ductile coating. A combination with other sulfur-containing 

brightening additives is also possible. For the chemical deposition of 

precious metals, DPS is used as a stabilizer to prevent wild deposition.

2-Meracapto-benzimidazole

CAS No:583-39-1     
Usages:It is soluble in alkaline solution, M is used as brightener for copper plating, which can brighten a
Introduction:

 

Chemical Name

2-meracapto-benzimidazole (M)

Molecular formula

C7H6N2S

CAS No.

583-39-1

EINECS No.

209-502-6

Molecular weight

150.2

Molecular Structure

Details

Appearance: White crystal

Assay:≥99% 

Melting point: 303~304℃

Addition level: 0.5~1.0mg/l

Consumption (g/KAH): 0.01~0.05  

Main Application

It is soluble in alkaline solution, M is used as brightener for copper plating,

 which can brighten and level the deposit. Furthermore, it can improve working 

current density. 

MPS

CAS No:17636-10-1     
Usages:In the electroplating industry MPS serves as a brightening agent in acid copper baths to improve the
Introduction:

 

Chemical Name

3-Mercapto-1-propanesulfonic acid sodium salt (MPS)

Molecular formula

C3H7O3S2Na

CAS No.

17636-10-1

EINECS No.

241-620-3

Molecular weight

178.21

Molecular Structure

Details

 

Appearance: White glossy plate crystal

Assay: 90.0% min.

Solubility(at 20℃): In water approx.50% (slightly soluble in alcohols)

Addition level : 20~100mg/l

Packing: 25kg or 5kg / fiber drum or as required

Main Application

In the electroplating industry MPS serves as a brightening agent in 

acid copper baths to improve the deposition of copper coatings for

 decorative and functional purposes. The use of MPS together with

 polyethers and non-ionic surfactants results in brilliant and ductile coatings

. An additional combination with polymeric amines, dyestuffs and other

 thio compounds in possible as well.

Ethenethiourea

CAS No:96-45-7     
Usages:It is soluble in hot alcohol solution. It is used as brightening agent for copper plating and combin
Introduction:

 

Chemical Name

Ethenethiourea

Molecular formula

C3H6N2S

CAS No.

96-45-7

EINECS No.

202-506-9

Molecular weight

102.16

Molecular Structure

Details

 Appearance: White crystal
Assay: ≥98%
Melting point: 197~198℃
Addition level : 0.3~0.8mg/l

Consumption (g/KAH): 0.01~0.05

Main Application

It is soluble in hot alcohol solution. It is used as

 brightening agent for copper plating and combined 

with acidic copper plating brightener M, SP and so on.

Poly(ethylene glycol)

CAS No:25322-68-3     
Usages:Used as primary light leveling agent,improving dispersion ability. Also be used crystal materials re
Introduction:

 

Chemical Name

Poly(ethylene glycol)(PEG8000-12000)

Molecular formula

C2H4O)n

CAS No.

25322-68-3

EINECS No.

203-473-3

Molecular weight

 

Molecular Structure

 

Details

Appearance: White flaky crystal

Assay: ≥99%

Addition level : 0.05~0.1g/l

Consumption (g/KAH): 0.4~0.6

Main Application

Used as primary light leveling agent,improving dispersion ability.

 Also be used crystal materials refined agent for copper plating.

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